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    Analysis and feasibility of an evaporative cooling system with sessile droplet evaporation to provide cooling for microprocessors

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    Chakraborty_Soma.pdf (1.692Mb)
    Date
    2017-04-01
    Author
    Chakraborty, Soma
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    Abstract
    The study investigates the cooling requirements for the Intel Xenon Processor and the Intel Core i7-900 Processor using diffusion based evaporation of sessile droplets. An analytical model is developed to determine the capacity of a single layer of droplets to provide sufficient cooling. It is found that a single layer can provide sufficient cooling for the processors with tiny droplets. A numerical model is developed to analyze a tiered system that fits within the space restrictions corresponding to the current heat sinks with larger droplets and fewer of them. The results of the numerical modelling work found that a minimum of 41 posts connecting each of the tiers were required to cool the Xenon Processor and 42 posts for the Core i7-900 Processor. It was also found that a minimum of 3 tiers were required for the Xenon Processor, with a droplet radius of 2 mm, and 4 tiers for the Core i7.
    URI
    https://hdl.handle.net/10155/775
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